Modern Printed Circuit Board Assemblies mainly consist of Surface Mount Devices (SMD). Surface Mount Devices are electronic components placed and soldered onto the surface of a printed circuit board. The transition to Surface Mount Technology is driven by the advantage of placing smaller components that perform the same but occupy less space on the Printed Circuit Board.

Wave Soldering is the production method favored for through-hole only assemblies which involves inserting leads of components into drilled holes in the Printed Circuit Board and soldering on the opposite side. The evolution of Surface Mount components has replaced the majority of through hole assembly components originally designed onto Printed Circuit Board Assemblies. Even with the technology shift, many designers still favor or require THT components for design specific placements. These placements include connectors, capacitors, relays, transformers, potentiometers, LED’s, etc. Our technicians are highly skilled soldering operators. Our solutions include selective wave soldering machines with Nitrogen enhancement, traditional wave soldering or manual soldering. Some assemblies will require more than one of these processes listed above.