Through Hole Assembly
Selective Solder for Through Hole Assembly
Selective Soldering provides a repeatable Robotic Motion with production quality results for through-hole technology components. These machines are used as an alternative to manual or wave soldering. Most assemblies now have Surface Mount Devices soldered on both sides of the Printed Circuit Board Assembly. With Selective Soldering each through-hole lead can be soldered without disturbing SMT components on the boards adjacent to these through-hole solder joints. This is a program based process that locks the PCBA in place while it sprays flux at the solder point then brings a fountain of molten solder to this programmed location. The result is a precision controlled production intent solder joint without the time and expense of fixtures required to mask SMT components during Wave Soldering. Removable solder pots allow us to solder “Lead-Free” assemblies then change over to “leaded” assemblies in the same shift.
Nitrogen Enhanced Selective Soldering
Hughes Electronics Products uses Nitrogen Generators to create pure nitrogen from the compressed air system used throughout the shop. Soldering in a Nitrogen Atmosphere is an essential part of our selective soldering process. Soldering without a nitrogen atmosphere leaves solder joints open to the possibility of oxidizing and the loss of long term reliability.
Wave Solder
Wave Soldering is a production method favorable for through hole assembly or mixed technology assemblies with all components mounted on one side of the printed circuit board. We do have customers with Thru-Hole only legacy products that utilize our wave solder line. Wave Solder is a standard process offered by all full-service Contract Electronic Manufactures.
To get started on your Printed Circuit Board Assembly project, contact us today.